DETECT ROOT CAUSE TO PREVENT FAILURE
Regardless of what we hope or even expect, no product has a 0% defect rate. Finding the root cause helps us to deal with today’s problem and prevent it from happening again. The term is known as Failure Analysis.
Failure analysis is conducted to determine the failure’s source when a product fails. In electronics, the source of the failure, or failure mode, could be an application-induced failure component, the quality of the PCBA (printed circuit board assembly), a component including the PCB (printed circuit board), or even a design fault. Failure analysis aims to determine the source so that the problem can be resolved.
The main issue for metal failure is related to the correlation of failure with the structure and the microstructure of metals and metal welds with their properties.
Regardless of what we hope or even expect, no product has a 0% defect rate.
Finding the root cause helps us to deal with today’s problem and prevent it from happening again. The term is known as Failure Analysis.
A failure analysis is conducted to determine the source of the failure when a product fail. In electronics, the source of the failure, or failure mode, could be an application induced failure component, the workmanship of the PCBA (printed circuit board assembly), a component including the PCB (printed circuit board), or even a design fault.
The main issue for metal failure is related to the correlation of failure with the structure and the microstructure of metals and metal welds with their properties.
THREE MAIN ISSUES ARE RELATED TO METAL FAILURE ANALYSIS:
First issue:
Prediction of failure based on the structural and microstructural characterisation of metals, alloys, and their welds; even more importantly, a crucial issue is related to the correlation of structure and microstructure of metals alloys and their welds with electric, magnetic, optic, mechanical, and thermal properties, to non-destructively monitor the possible areas of failure.
Second issue:
Concerns the rehabilitation of metals, alloys, and their welds. Rehabilitation may occur with several methods, based on heat and localised heat processes, as well as on other methods, such as the KREEP process, mechanical treatment, etc.
Third issue:
The industrialisation of the failure monitoring and metal rehabilitation process. The findings of basic research, concerning failure studies and rehabilitation processes should be implemented for industrial applications.
Our expert testing team will analyse potential failure modes in five major phases
- Initial Investigation– In which we obtain all pertinent background information.
- Catalogue Evidence– Collect and collate all physical evidence from the failure.
- Testing– This may include non-destructive testing, chemical analysis, mechanical testing and metallographic examination of the failed parts.
- Evidence Interpretation– We amass the collected evidence and test results and formulate our conclusions.
- Make Recommendations– We present our conclusions and recommendations for remedial action.
HOW DO WE ANALYZE POTENTIAL FAILURE MODES IN FIVE MAJOR PHASES?
Initial Investigation
Catalogue Evidence
Testing
Initial Investigation
Catalogue Evidence
Testing
Evidence Interpretation
Make Recommendations
Evidence Interpretation
Make Recommendations
Talk to us today
Professional Testing Services is here to help you discover the reasons for failure and develop methods and processes to prevent future failure. Our expert testing team provide solutions for metal failures, regardless of where or when they occur. We help you pinpoint the root cause and recommend ways to prevent the failures from happening again.
For more information on our failure mode and effects analysis, call us or send us your enquiry today.
